Taiwanese chip giant TSMC is expected to begin building its third chip factory in Arizona as early as June—much earlier than the original schedule. According to Economic Daily, the company is moving up its timeline by about a year, showing how seriously it’s taking its U.S. expansion plans.
TSMC has also told its suppliers to get advanced packaging tools ready for shipment to the U.S., hinting that construction on its American packaging plant could start soon. The company plans to spend around $165 billion on its U.S. chip and packaging projects, possibly to prepare for any new tariffs the U.S. might place on foreign-made semiconductors.
